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Standard

Alignment of Nut Slots

1990-01-01
CURRENT
J484_199001
This method of gaging alignment of nut slots allows equal variations for location of the cotter pin hole in the bolt and location of slots in the nut. To inspect the nut, the slotted gage is inserted through the nut hole from the bearing surface of the nut. Alignment of slots is considered satisfactory if the gage pin can be slipped into the gage and nut slots without interference.
Standard

Round Head Bolts

1990-01-01
CURRENT
J481_199001
Round head bolts are made in two body styles: (a) A full size body, with a maximum diameter somewhat greater than the nominal diameter (not an SAE Standard except for ribbed neck bolts, Table 3); and (b) an undersize body, with a minimum diameter approximating the pitch diameter of the thread and a maximum diameter never exceeding nominal (SAE standard for all types except ribbed neck bolts). The body diameter of either style may be exceeded by a reasonable swelling or fin under the head, or under corners of the square necks, to the extent that serviceability is not affected.
Standard

TOLERANCES, METRIC Aluminum Alloy Drawn Tubing

1994-04-01
MAM2203A
This specification covers established metric manufacturing tolerances applicable to aluminum alloy drawn tubing ordered to metric dimensions. These tolerances apply to all conditions, unless otherwise noted. The term "excl" applies only to the higher figure of the specified range.
Standard

TOLERANCES, METRIC Aluminum Alloy Drawn Tubing

2002-07-23
MAM2203
This specification covers established metric manufacturing tolerances applicable to aluminum alloy drawn tubing ordered to metric dimensions. These tolerances apply to all conditions, unless otherwise noted. The term "excl" applies only to the higher figure of the specified range.
Standard

LOGICAL SOFTWARE PART PACKAGING FOR TRANSPORT

2020-11-16
CURRENT
ARINC641-1
The purpose of this standard is to provide a method for packaging aircraft software parts for distribution using contemporary media or by electronic distribution. This project intends to standardize and provide guidance for the storage of floppy based software, currently packaged in media set parts. This standard format can be then stored or distributed on a single physical media member (CD-ROM), or by electronic crate. The obsolescence of floppy disks drive an urgent need for this guidance.
Standard

Manufacturing Message Specification – Service Definition and Protocol

2016-06-28
CURRENT
EIA511
The Manufacturing Message Specification is an application layer Standard designed to support messaging communications to and from programmable devices in a Computer Integrated Manufacturing (CIM) environment. This environment is referred to in this Standard as the manufacturing environment. This Standard does not specify a complete set of services for remote programming of devices, although provision of such a set of services may be the subject of future standardization efforts.
Collection

Welding and Joining and Fastening, 2010

2010-06-01
The 12 papers in this techncial paper collection represent research in the areas of welding, riveting, joining, and fastening for automotive applications. Papers focus on the recent advances in the process optimization, analytical solution, numerical modeling, response evaluation as well as static and dynamic testing of traditional resistance spot welds, gas metal arc welds, friction stir spot welds, laser welds, rivets, mounts, adhesives, and fasteners.
Video

High Temperature Power Device and Packaging - The Technology Leap to Achieve Cost, Power Density and Reliability Target

2011-11-07
The three major challenges in the power electronics in hybrid and electric vehicles are: System cost, power density and reliability. High temperature power device and packaging technologies increases the power density and reliability while reducing system cost. Advanced Silicon devices with synthesized high-temperature packaging technologies can achieve junction temperature as high as 200C (compared to the present limitation of 150C) eliminating the need for a low-temperature radiator and therefore these devices reduces the system cost. The silicon area needed for a power inverter with high junction temperature capability can be reduced by more than 50 - 75% thereby significantly reducing the packaging space and power device and package cost. Smaller packaging space is highly desired since multiple vehicle platforms can share the same design and therefore reducing the cost further due to economies of scale.
Video

Plug-In Charging Systems Monitoring

2012-02-01
Low Voltage Electric Drives are becoming very attractive for various applications in the Turf, Construction and Agricultural products being engineered today. Determining what the Customer Support Requirements are for Maintenance and Repair for the Life Cycle of the products is critical to the initial design process. Presenter Russell Christ
Video

Estimating Return on Investment for SAVI (a Model-Based Virtual Integration Process)

2012-03-21
The System Architecture Virtual Integration (SAVI) program is a collaboration of industry, government, and academic organizations within the Aerospace Vehicle System Institute (AVSI) with the goal of structuring a new integration process that relies on a single-truth architectural framework. The SAVI approach of Integrate, then Build provides a modern distributed development environment which arrests the propagation of requirements errors through the development life cycle. It does so by capturing design assumptions and shared properties of the system design in an authoritative, annotated architectural model. This reference model provides a common, analyzable framework for confirming that system requirements remain complete, consistent, and correct at all levels of system decomposition. Core concepts of SAVI include extensive use of model-based system engineering tools and use of a single-truth reference architectural model.
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